HFCL Limited, a leading communications solution provider, has teamed up with chip-maker MediaTek to assist Indian telcos in overcoming last-mile connectivity hurdles with their innovative 5G solutions. Both HFCL, MediaTek partnership aims to integrate MediaTek’s chipset with HFCL’s indoor 5G solution, offering advanced features to telecom operators.

HFCL’s 5G FWA Indoor CPE, powered by MediaTek’s T750 chipset, boasts an ultra-compact design and minimal power consumption. Equipped with a 7nm compact chipset featuring a 5G radio and quad-core Arm CPU, it ensures seamless connectivity across multiple devices with dual-band 4×4 Wi-Fi 6 support.

Mahendra Nahata, Managing Director of HFCL, expressed confidence in the HFCL, MediaTek partnership’s ability to address last-mile connectivity challenges effectively. The HFCL 5G FWA Indoor CPE provides a fiber-like experience to consumers and enterprises, featuring a 2.5 Gbps Ethernet interface for high-speed data transfer and an embedded eSIM for added convenience. Moreover, it is a plug-and-play device with an AI-integrated mobile app, facilitating user-friendly self-installation and optimal signal location identification.

Evan Su, General Manager of Wireless Communications at MediaTek, emphasized the collaboration’s contribution to supporting the Indian government’s vision of fostering a sustainable telecom ecosystem through local manufacturing promotion. By offering full functionality and enabling high-performance CPE products in efficient form factors, MediaTek’s modem aligns with this vision, propelling the growth of the telecom sector.

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